Industrial Machinery Business Unit

Machine for the WSP (Wafer Scale Package): Model NK8812L

Features of NK8812L

  • Machine is specialized for the WSP (Wafer Scale Package)
  • Total process System: Picking Die up from Wafer -> Quality (Appearance) Inspection and Alignment with Cameras -> Tape & Reel
  • Smooth Handling of Die (No pressure or damage on Die)
  • Extra small Die (up to 0.5mm square) can be applied with the Full Vision support and accurate mechanism.
  • Can be applied in various ways, such as Wafer to Tape, Wafer to Tray, Tray to Tape, Tape to tape/Tray (de-taping)
  • Wafer Auto laoding system is provided

Download Catalog: NK8812L

NK8812L Catalog PDF (112KB)

Major Specifications

Productivity7,000 Units / hour (0.55 sec./unit)
Applicable range of Carrier tape sizeWidth: 8mm & 12mm (16mm option)
Embossed tape pitchPocket Pitch: 2, 4 & 8mm (12mm option)
Applicable size of Wafer Ring12 inches
Capable numbers of Wafer Rings at Wafer LoaderMax. 25 rings
Wafer Auto LoaderProvided

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